李海龙
教师名称：李海龙
教师拼音名称：Li Hailong
出生日期：1984-02-18
性别：男
职称：讲师
其他联系方式
邮箱：dragoneptech@163.com
基本信息
研究方向
获奖情况
论文成果
Areas of research interest1. Electronics Packaging Technology< br>2. Micro-/Nano-Joining Technology< br>3. Reliability Testing and Analysis< br>4. Numerical SimulationSelected publications (Journal articles, patents and books)[1]Hailong Li, Rong An, Chunqing Wang, et al. Suppression of void nucleation in Sn3.0Ag0.5Cu/Cu solder joint by rapid thermal processing [J]. Mater Lett, 2015, 158(0): 252-4.< br>[2]Hailong Li, Rong An, Chunqing Wang, et al. In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging [J]. J Alloy Compd, 2015, 634(0): 94-8.< br>[3]Hailong Li, Rong An, Chunqing Wang, et al. Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints [J]. Mater Lett, 2015, 144(0): 97-9.
Electronics Packaging Technology
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教育经历
2005.9-2009.7
Harbin Institute of Technology Welding Science and Engineering 学士
2009.9-2011.7
Harbin Institute of Technology Materials Processing Engineering 硕士
2011.9-2015.10
Harbin Institute of Technology Materials Processing Engineering 博士
工作经历
2015.12
-2019.12
|School of Materials Science and Engineering|Tianjin University|Lecturer |
